Product Category
ZQ-211 two-component electronic potting adhesive
ZQ-211 two-component electronic potting adhesive

ZQ-211 two-component electronic potting adhesive

ZQ-211 is a universal room temperature curing two component organic silicon potting product. This product does not require any other primer before use and has a certain bonding effect on most materials. It is suitable for fixing electronic accessories, as well as preventing water, dust, and leakage.

Main Configuration

1、 Product features:
ZQ-211 is a universal room temperature curing two component organic silicon potting product. This product does not require any other primer before use and has a certain bonding effect on most materials. It is suitable for fixing electronic accessories, as well as preventing water, dust, and leakage.

 

2、 Typical use:
This product is suitable for fixing and insulating various electronic accessories; Moisture and waterproofing of electronic accessories and PCB substrates; Packaging of LED displays; Other general insulation molding.


3、 Technical parameters before and after curing:

Performance indexZQ-211
Before curingComponent AAppearanceTransparent/Black/White/Grey Fluid
Viscosity(cps)500~80000
Relative density(g/cm3)1.05~1.25
Component BAppearanceColorless or light yellow liquid
Viscosity(cps)10~150
Relative density(g/cm3)0.98~1.02
Component A: Component B (weight ratio)10:1
Curing typeTwo component condensation dealcohol type
Viscosity after mixing(cps)400~60000
Operational time(min)15~120
Initial curing time(hr)2~4
Complete curing time(D)7
 

After

curing

Hardness(Shore A,24hr)10~35
Tensile strength(MPa)≥1.00
Shear strength(MPa)≥0.80
Linear shrinkage  (%)0.3
Operating temperature range(℃)-60~200
Volume resistivity  (Ω·cm)1.0×1015
Dielectric strength (kV/·mm)≥18
Dielectric constant (1.2MHz)2.8
Scope of useAdhesive potting
The biggest featureUniversal potting adhesive for potting general electronic components

The above performance data were all measured at 25 ℃ and a relative humidity of 55% after curing for 1 day. Our company does not assume any responsibility for data differences caused by different testing conditions or product improvements.

 

4、 Usage process:

1. Before mixing, component A needs to be thoroughly and evenly stirred using a manual mixer or other container, while component B needs to be fully shaken in a covered state before use.

2. When it is necessary to attach to the applied material, please confirm whether it can be attached before use before applying.

3. The weight ratio of A and B is A: B=10:1. If it is necessary to change the operability and other conditions, it should be distinguished from the above ratios. The mixing ratio should be changed and a simple experiment should be conducted before application. At this point, the more component B is used, the shorter the curing time and the shorter the usable time.

4. When manually mixing, if the molding depth is deep, bubbles or pinholes may occur on the surface and inside. Therefore, the mixture should be placed in a vacuum container and defoaming at 0.06MPa for at least 5 minutes.

 

5、 Precautions:

1. Adjustment of gel time:

Changing the amount of component B can adjust the gel time (operation time), increasing the amount of component B can appropriately shorten the gel time, and reducing the amount can appropriately extend the gel time. Users can adjust within the range of ± 20% according to actual needs.

2. Regarding mixing:

a. After mixing component A and component B, manual or mechanical stirring can be used. During mixing, high temperature should be avoided due to high-speed and prolonged stirring (not higher than 38 ℃), in order to avoid shortening the operation time and accelerating solidification, which may result in delayed operation.

b. The surface of the sealed product must be cleaned before sealing.

c. When using manual mixing, the adhesive material adhered to the bottom and sides of the container should be folded in several times towards the middle (allowing component A adhesive to fully contact component B).

3. Generally, low voltage electrical appliances can be sealed without defoaming. If high voltage electrical appliances are sealed, vacuum defoaming and sealing must be carried out.

4. The adhesive and curing agent should be stored in a sealed manner. The mixed adhesive should be used up at once to avoid waste.

5. This product is not a hazardous material, but do not enter or eye contact.

6. This series of adhesives release low molecular alcohol substances during the curing process. For those with high requirements for temperature resistance (such as resistance to more than 180 ℃ within 7 days), the subsequent accelerated curing process can be adopted by heating the colloid for several hours after 5 hours of gel (generally the temperature of heating is less than 60 ℃, which can be used for 2 to 24 hours), which will greatly help the temperature resistance of the colloid. (Do not use in completely enclosed electronic components without waiting for small molecule substances to be released.)

7. The B-component curing agent is colorless or slightly yellowish, and over time, the color may gradually turn yellow or settle slightly, but it does not affect the use of the product.

8. After storage for a period of time, component A may experience settlement or layering of some fillers, and should be stirred evenly before use.

 

6、 Executive standard: Q/320481 MTH 002-2016:Q/320481 MTH 002-2016

 

7、 Packaging specification:22 Kg/set. (20kg of adhesive+2Kg of curing agent)

 

8、 Storage and transportation:

1. Store in a cool and dry place for 1 year (at 25 ℃).

2. This type of product belongs to non hazardous goods and can be transported as general chemicals.

3. The A and B components of the colloid must be sealed and stored to prevent leakage during transportation!

4. Products that have exceeded their shelf life should be confirmed for any abnormalities before use.


9、 Company Information:Jiangsu Mingming Rubber Industry Co., Ltd

Address: No. 12 Changjiang East Road, Daibu Town, Liyang City, Jiangsu Province

Tel: 0519-87900316

Fax: 0519-87909192


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