ZQ-311 is a two-component addition molding silicone thermal conductive electronic potting adhesive that can cure at room temperature or heat, with the characteristic of faster curing at higher temperatures. This product does not produce any by-products during the curing reaction and can be applied to materials such as PC (Poly carbon), PP, ABS, PVC, and metal surfaces. It has excellent thermal conductivity and is suitable for insulation, heat dissipation, and waterproofing of electronic accessor
ZQ-311 is a two-component addition molding silicone thermal conductive electronic potting adhesive that can cure at room temperature or heat, with the characteristic of faster curing at higher temperatures. This product does not produce any by-products during the curing reaction and can be applied to materials such as PC (Poly carbon), PP, ABS, PVC, and metal surfaces. It has excellent thermal conductivity and is suitable for insulation, heat dissipation, and waterproofing of electronic accessories.
This product is suitable for bonding and sealing various high-power electronic components; Sealing protection for module power supplies and circuit boards with high requirements for heat dissipation and temperature resistance.
Component A: Component B (weight ratio)
Operating time at 25 ℃ (min)
25 ℃ curing time (min)
Curing time (min, 80 ℃)
Thermal conductivity [ W（m·K）]
Volume resistivity （Ω·cm）
Linear expansion coefficient [m/（m·K）]
Flame retardant performance
Note: The above performance data were all measured at 25 ℃ and 55% relative humidity after 1 day of curing. Our company does not assume any responsibility for data differences caused by different testing conditions or product improvements.
1. Before mixing, first mix components A and B thoroughly in their respective containers.
2. When mixing, the weight ratio of component A: component B=1:1 should be followed.
3. Generally speaking, molds with a thickness of 20mm or less can naturally defoaming after molding. Due to the accelerated curing rate or deeper molding depth caused by high temperature, defoaming can be carried out as needed. At this point, in order to remove the bubbles generated on the surface and inside after molding, the mixture should be placed in a vacuum container and de foamed at 0.08 MPa for at least 5 minutes.
4. The corresponding curing time should be used above the temperature given in the technical parameter table before and after curing, either at room temperature or by heating for curing. The curing speed of the adhesive is influenced by the curing temperature, and it takes a long time to cure in winter. It is recommended to use heating method for curing, which takes 15 minutes to cure at 80-100 ℃, and generally takes about 8 hours to cure at room temperature of 25 ℃.
The following substances may hinder the solidification of this product or cause uncured phenomena. Therefore, it is recommended to apply them after simple experimental verification. If necessary, the application area needs to be cleaned.
◆ Incomplete curing condensed silicone.
◆ Amine cured epoxy resin.
◆ Solder flux treatment.
1. The adhesive should be stored in a sealed manner. The mixed adhesive should be used up at once to avoid waste.
2. This product is not a hazardous material, but do not enter or eye contact.
3. After storage for a period of time, the adhesive may become layered. Please mix well before use, without affecting performance.
4. Contact of the adhesive with the following chemicals will cause ZQ-311 to not solidify:
a. Organic tin compounds and silicone rubber containing organic tin.
b. Materials such as sulfur, sulfides, and sulfur-containing rubber.
c. Amine compounds and materials containing amines.
During use, please be careful to avoid contact with the aforementioned substances.
6、 Executive standards:
Q/320481 MTH 002-2016
10Kg/set. (Component A 5Kg+Component B 5Kg).
1. The storage period of this product is 1 year (below 25 ℃).
2. This type of product belongs to non hazardous goods and can be transported as general chemicals.
3. Products that have exceeded their shelf life should be confirmed for any abnormalities before use
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