What factors are related to the deep curing of silicone adhesive

Sort:Product EncyclopediaRelease time:2023-05-22 15:32:35

The application of silicone adhesive in electronic products plays a role in sealing, fixing, filling, etc. However, its performance must be fully cured as a whole, and it is necessary to ensure the normal and complete curing of silicone adhesive. Therefore, some influencing factors need to be avoided during its deep curing process. Today, the editor will explain the factors that affect the deep curing of adhesive.

1、 Gluing humidity

The organic silicon adhesive described here is a single component condensation type organic silicon adhesive, and its curing process requires the use of moisture in the air for condensation reaction. If there is a lack of moisture or too low moisture, it will slow down the condensation reaction speed and cause it to not cure according to the required time. For example, at 55% humidity, the deep curing thickness at 24 hours is 4-5mm. Due to the on-site environmental humidity of only 30%, the curing depth will not reach 4-5mm, If the required adhesive thickness is 4mm, it will result in the inability to preliminarily form.

2、 Adhesive thickness

The curing process of organic silicon single component adhesive requires several stages, including surface drying, skinning, deep curing, preliminary overall curing, and complete curing. Under the same environmental conditions, the thicker the adhesive thickness, the longer the curing stage is completed. The main reason is that deep curing takes time. The thicker the adhesive, the harder it is for the internal liquid adhesive to contact the air, and the longer the curing duration will be. Therefore, the same model of product is used in the same environment, The required curing time varies depending on the application thickness.

3、 Colloidal properties

Colloidal properties should be explained here, which refers to the curing speed or strength. Generally, the faster the surface drying speed, the stronger the curing strength of the adhesive, and the overall curing speed will be relatively fast. Therefore, when choosing a fast curing silicone adhesive, reference can be made based on the surface drying time and the speed of the peeling time.

So it is very important to understand the significance of deep curing of silicone single component adhesive, which can avoid and prevent the phenomenon of internal colloid not curing when the product reaches the end customer. As mentioned above, there are several key control times during the curing stage of the adhesive,

Organic silicon adhesive Single component condensation adhesive

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