The main function of using thermal conductive silicone on electronic products is to fill the gap between the contact surfaces, squeezing air out of the contact surfaces to reduce the contact thermal resistance between the heat source surface and the contact surface of the radiator component. After being applied to heat dissipation components, thermal conductive silicone will become more and more firmly bonded to the contact surface of the heat dissipation components after multiple heat absorption and release processes. So how can the cured thermal adhesive be disassembled without causing significant damage to the components when re gluing or recycling them?
1. Mechanical method: The adhesive can be removed using methods such as impact or tapping. This method is simple and practical, but it is not recommended because mechanical adhesive removal can cause different damages to the heat dissipation components;
2. Heating method: Heat the adhesive to the upper limit of the adhesive thermal conductive silicone, which can withstand temperature or higher. After a certain period of time, the silicone adhesive will carbonize and fail. This method is also applicable to anaerobic and epoxy thermal conductive adhesives.
3. Dissolution method: For example, phosphate inorganic adhesive can be dissolved in ammonia water, silicate inorganic adhesive can be dissolved in water, phenolic acetal adhesive can be dissolved in concentrated caustic soda water, and so on.
These three methods are summarized based on the physical properties of thermal conductive silicone itself. Overall, there is a certain degree of damage to electronic components. Therefore, a good approach is to choose appropriate thermal conductive materials during the initial construction to avoid secondary adhesive application.