The difference between solid silicone and liquid silicone

Silicone is in a liquid state and has flowability. It is a highly transparent and safe food grade material that does not add auxiliary materials such as vulcanizing agents during molding, and is sealed and fed for molding. Solid silica gel is in a solid state and has no fluidity. It is also a transparent and environmentally friendly material that requires the addition of a vulcanizing agent to accelerate the vulcanization molding time and open mold feeding for molding. What is the difference bet

Performance and Service Life Analysis of Structural Adhesive

The performance and lifespan of silicone structural adhesives have been a long-standing topic of concern in the industry, with manufacturers, construction units, direct users, and designers paying close attention. A small adhesive strip is like a sewing thread, which elastically connects building fasteners and also bears corresponding forces. Like sewing thread, the amount and cost of this material are not significant, but its role is crucial. Due to the fact that most of the main materials in b

What factors are related to the deep curing of silicone adhesive

The application of silicone adhesive in electronic products plays a role in sealing, fixing, filling, etc. However, its performance must be fully cured as a whole, and it is necessary to ensure the normal and complete curing of silicone adhesive. Therefore, some influencing factors need to be avoided during its deep curing process. Today, the editor will explain the factors that affect the deep curing of adhesive.

Cleaning method after curing of thermal conductive silicone

The main function of using thermal conductive silicone on electronic products is to fill the gap between the contact surfaces, squeezing air out of the contact surfaces to reduce the contact thermal resistance between the heat source surface and the contact surface of the radiator component. After being applied to heat dissipation components, thermal conductive silicone will become more and more firmly bonded to the contact surface of the heat dissipation components after multiple heat absorptio

Market Analysis Report on Encapsulation Electronic Adhesive Industry

With the continuous improvement of China's technological level, the electronic information industry in China is constantly developing and the scale of the industry is also expanding. At present, China has become one of the three major electronic information product manufacturing countries in the world, and its position as a major electronic product manufacturing country is becoming increasingly prominent. Driven by the electronic information industry, the Chinese electronic adhesive market

Curing agent is another major component of electronic sealing adhesive and epoxy resin sealing mater

Curing agent is another major component of electronic sealing adhesive and epoxy resin sealing material. By selecting different curing agents, epoxy potting materials with different properties can be obtained. Amines and anhydride are two commonly used curing agents in the formulation system of potting materials.