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Cleaning method after thermal silica gel curing

Cleaning method after thermal silica gel curing

(Summary description)The main function of using thermally conductive silica gel in electronic products is to fill the gaps between the contact surfaces and to squeeze air out of the contact surfaces to reduce the contact thermal resistance between the surface of the heat source and the contact surface of the heat sink. After the thermally conductive silica gel is applied to the heat-dissipating components, after repeated heat absorption and release, the bonding with the contact surface of the heat-dissipating components will become stronger and stronger.

Cleaning method after thermal silica gel curing

(Summary description)The main function of using thermally conductive silica gel in electronic products is to fill the gaps between the contact surfaces and to squeeze air out of the contact surfaces to reduce the contact thermal resistance between the surface of the heat source and the contact surface of the heat sink. After the thermally conductive silica gel is applied to the heat-dissipating components, after repeated heat absorption and release, the bonding with the contact surface of the heat-dissipating components will become stronger and stronger.

Information

The main function of using thermally conductive silica gel in electronic products is to fill the gaps between the contact surfaces and to squeeze air out of the contact surfaces to reduce the contact thermal resistance between the surface of the heat source and the contact surface of the heat sink. After the thermally conductive silica gel is applied to the heat-dissipating components, after repeated heat absorption and release, the bonding with the contact surface of the heat-dissipating components will become stronger and stronger. So when the secondary sizing or the components are recycled, how can the cured thermal conductive glue be disassembled without causing major damage to the components?

1. Mechanical method: you can use methods such as impact or knocking to remove the glue. This is a simple and practical method, but it is not recommended, because mechanical removal of the glue will cause different damage to the heat dissipation components;

2. Heating method: Heat the adhesive parts to the upper limit temperature of Huiju Adhesive Thermal Conductive Silicone or higher. After a certain period of time, the silicone adhesive will be carbonized and become invalid. This method is also suitable for anaerobic and ring Oxygen thermal conductive adhesive.

3. Dissolution method: such as phosphate inorganic glue, which can be dissolved in ammonia water, silicate inorganic glue can be dissolved in water, phenolic-acetal glue can be dissolved in concentrated caustic soda, etc.

These three methods are summarized based on the physical characteristics of thermal silica gel. In general, there is a certain amount of damage to electronic components, so a good way is to choose suitable thermal conductive materials during the initial construction to avoid secondary sizing.

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